Cooling device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Apr 16, 2024
Grant Date -
Nov 17, 2022
app pub date -
Nov 30, 2021
filing date -
May 12, 2021
priority date (Note) -
In Force
status (Latency Note)
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Importance

US Family Size
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Non-US Coverage
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Abstract
A cooling device comprising a cooling circuit, is described. The cooling circuit further comprises a compressor adapted to compress cooling agent present in the cooling circuit during an active cooling mode, wherein the compressed cooling agent contains lubricant oil from the compressor; a condensing unit connected to the compressor by a first fluid line of the cooling circuit; and an evaporating unit, which is connected to the condensing unit by a second fluid line of the cooling circuit. The cooling circuit further comprises an expansion device arranged in the second fluid line; and an additional evaporator connected to the evaporating unit by a third fluid line of the cooling circuit, and connected to the compressor by a fourth fluid line of the cooling circuit.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
HUAWEI DIGITAL POWER TECHNOLOGIES CO LTD | SHENZHEN GUANGDONG 518043 |
International Classification(s)

- 2021 Application Filing Year
- F25B Class
- 957 Applications Filed
- 458 Patents Issued To-Date
- 47.86 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Filatau, Sviataslau Alehavich | Minsk, BY | 3 | 0 |
# of filed Patents : 3 Total Citations : 0 | |||
Qiu, Yongqi | Dongguan, CN | 4 | 0 |
# of filed Patents : 4 Total Citations : 0 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- F25B Class
- 0 % this patent is cited more than
- 1 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Oct 16, 2027 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Oct 16, 2031 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 16, 2035 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

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Sep 24, 2024 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YOUN, JEKWANG;KIM, YOUNGDON;YOO, HYUNSUN;AND OTHERS;REEL/FRAME:069310/0182 Owner name: LG ELECTRONICS INC., KOREA, REPUBLIC OF Effective Date: Sep 24, 2024 |
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Mar 19, 2020 | P | Published | |
Sep 18, 2019 | F | Filing | |
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