Package structure with supporting frame

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11959606
APP PUB NO 20210301993A1
SERIAL NO

17216827

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Importance

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Abstract

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A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
LITE-ON TECHNOLOGY CORPORATION22F NO 392 RUEY KUANG ROAD NEIHU TAIPEI 114
LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO LTD213161 NO 88 YANG HU ROAD WUJIN HI TECH INDUSTRIAL DEVELOPMENT ZONE JIANGSU CHANGZHOU CHINA CHANGZHOU CITY JIANGSU PROVINCE 213161

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Cheng-Ying New Taipei, TW 2 0
Lin, Chen-Hsiu New Taipei, TW 94 814
Tsai, Ming-Sung Taipei, TW 17 200

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