Method of manufacturing an in-plane metal microneedle array

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United States of America Patent

PATENT NO 11951271
APP PUB NO 20210046298A1
SERIAL NO

16960177

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Abstract

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A high aspect ratio in-plane metal microneedle array, a manufacturing method and a clamping and inserting auxiliary device thereof is disclosed. A large-size metal sheet is cut into small metal sheets. A clamping tooling composed of two upper and lower metal cover plates is processed. Inner sides of the upper and the lower cover plates of the tooling are provided with grooves in which the metal sheets are placed and fastened by bolts. Wire cutting is conducted on the tooling and the metal sheets as a whole to obtain a plane metal microneedle array with a plurality of microneedle bodies. In addition, an assembling and clamping device and an inserting auxiliary device of the high aspect ratio in-plane metal microneedle array is provided. The assembled inserting auxiliary device is placed on skin, and the microneedle array is inserted into the skin through the auxiliary device.

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Patent Owner(s)

Patent OwnerAddress
DALIAN UNIVERSITY OF TECHNOLOGY116033 NO 2 LINGGONG ROAD GANJINGZI DISTRICT DALIAN CITY LIAONING PROVINCE DALIAN CITY LIAONING PROVINCE 116033

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
An, Xiaolong Liaoning, CN 1 0
Han, Xiao Liaoning, CN 237 1151
Lv, Yongtao Liaoning, CN 3 1
Ma, Guojun Liaoning, CN 6 56
Ma, Jianli Liaoning, CN 5 124
Wu, Chengwei Liaoning, CN 19 36
Zhang, Wei Liaoning, CN 2625 19909

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