Method of manufacturing a bonded substrate stack by surface activation

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United States of America Patent

PATENT NO 11948912
APP PUB NO 20230178512A1
SERIAL NO

18104456

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Abstract

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A method of manufacturing a bonded substrate stack includes: providing a first substrate having a first hybrid interface layer, the first hybrid interface layer including a first insulator and a first metal; and providing a second substrate having a second hybrid interface layer, the second hybrid interface layer including a second insulator and a second metal. The hybrid interface layers are surface-activated to generate dangling bonds on the hybrid interface layers. The surface-activated hybrid interface layers are brought into contact, such that the dangling bonds of the first hybrid interface layer and the dangling bonds of the second hybrid interface layer bond together to form first insulator to second insulator bonds and first metal to second metal bonds.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGCAMPBELL 1-15 NAUBIBERG GERMANY NEUBIBERG BAVARIA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Frey, Alexander Lappersdorf, DE 59 304
Sigl, Alfred Sinzing, DE 33 362

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