Bonded body, circuit board, and semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11948900
SERIAL NO

17446765

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Abstract

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A bonded body according to an embodiment includes a substrate, a metal member, and a bonding layer. The bonding layer is provided between the substrate and the metal member. The bonding layer includes a first particle including carbon, a first region including a metal, and a second region including titanium. The second region is provided between the first particle and the first region. A concentration of titanium in the second region is greater than a concentration of titanium in the first region.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBAKANAGAWA KANAGAWA
TOSHIBA MATERIALS CO LTD8 SHINSUGITA-CHO ISOGO-KU YOKOHAMA-SHI KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujisawa, Sachiko Kawasaki, JP 13 1
Naba, Takayuki Chigasaki, JP 28 372
Suenaga, Seiichi Yokohama, JP 71 907
Yonetsu, Maki Mitaka, JP 41 572

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