Method of fabricating reticle

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United States of America Patent

PATENT NO 11940737
APP PUB NO 20210263425A1
SERIAL NO

17315087

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDHSINCHU

International Classification(s)

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  • 2021 Application Filing Year
  • H01L Class
  • 28775 Applications Filed
  • 15216 Patents Issued To-Date
  • 52.88 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Tzong-Sheng Hsinchu County, TW 37 310
Chen, Kuei-Shun Hsinchu, TW 77 560
Chen, Meng-Wei Taichung, TW 19 110
Chen, Yung-Cheng Hsinchu County, TW 37 855
Chuang, Jui-Ping Hsinchu, TW 27 168
Chung, Hsueh-Yi Hsinchu County, TW 7 13
Fu, Shih-Chi Hsinchu County, TW 63 369
Hsu, Wei-Ti Hsinchu County, TW 7 19
Liao, Chi-Hung New Taipei, TW 140 223
Tsai, Fei-Gwo Taipei, TW 33 272

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3335716251501 - 1011 - 20020004000600080001000012000140001600018000200002200024000260002800030000320003400036000

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