Methods and apparatus for precleaning and treating wafer surfaces

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11939666
APP PUB NO 20210371972A1
SERIAL NO

16889017

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Abstract

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Methods and apparatus for processing a substrate include cleaning and self-assembly monolayer (SAM) formation for subsequent reverse selective atomic layer deposition. An apparatus may include a process chamber with a processing volume and a substrate support including a pedestal, a remote plasma source fluidly coupled to the process chamber and configured to produce radicals or ionized gas mixture with radicals that flow into the processing volume to remove residue or oxides from a surface of the substrate, a first gas delivery system with a first ampoule configured to provide at least one first chemical into the processing volume to produce a SAM on the surface of the substrate, a heating system located in the pedestal and configured to heat a substrate by flowing gas on a backside of the substrate, and a vacuum system fluidly coupled to the process chamber and configured to control heating of the substrate.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Feng San Jose, US 635 6497
Chen, Lu Cupertino, US 195 885
Ha, Tae Hong San Jose, US 38 496
Jansen, Alexander San Jose, US 21 148
Kamath, Aravind San Jose, US 8 91
Leal, Cervantes Carmen Mountain View, US 16 2
Tang, Xianmin San Jose, US 168 2484
Tsai, Cheng-Hsiung Matthew Cupertino, US 15 110
Xie, Xiangjin Fremont, US 38 130
Xu, Wenjing San Jose, US 20 16

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