Method of producing electronic components, corresponding electronic component

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United States of America Patent

PATENT NO 11935818
APP PUB NO 20210305134A1
SERIAL NO

17328933

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Abstract

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A method of producing electronic components including at least one circuit having coupled therewith electrical connections including metallic wire bondable surfaces encased in a packaging, the method including bonding stud bumps, in particular copper stud bumps, at determined areas of said wire bondable surfaces.

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Patent Owner(s)

Patent OwnerAddress
STMICROELECTRONICS S R L20864 AGRATE BRIANZA (MB)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Marchisi, Fabio Milan, IT 14 8

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