Boron nitride for mask patterning

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United States of America Patent

PATENT NO 11935751
APP PUB NO 20220384189A1
SERIAL NO

17330013

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Exemplary deposition methods may include delivering a boron-containing precursor and a nitrogen-containing precursor to a processing region of a semiconductor processing chamber. The methods may include providing a hydrogen-containing precursor with the boron-containing precursor and the nitrogen-containing precursor. A flow rate ratio of the hydrogen-containing precursor to either of the boron-containing precursor or the nitrogen-containing precursor may be greater than or about 2:1. The methods may include forming a plasma of all precursors within the processing region of the semiconductor processing chamber. The methods may include depositing a boron-and-nitrogen material on a substrate disposed within the processing region of the semiconductor processing chamber.

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Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fu, Qian Pleasanton, US 76 1110
Kim, Jeong Hwan San Jose, US 104 441
Kwak, Yeonju Sunnyvale, US 3 0
Padhi, Deenesh Sunnyvale, US 150 5722
Yang, Chuanxi Los Altos, US 10 5
Yang, Xiawan San Jose, US 13 94
Yu, Hang San Jose, US 79 149
Zhu, Siyu San Jose, US 16 8

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