Stack package and methods of manufacturing the same
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United States of America Patent
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Mar 12, 2024
Grant Date -
Aug 3, 2023
app pub date -
Apr 10, 2023
filing date -
Sep 21, 2017
priority date (Note) -
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Abstract
A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.
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