Methods, apparatus, and systems for fabricating solution-based conductive 2D and 3D electronic circuits

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11926524
SERIAL NO

17354474

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

This work develops a novel microfluidic method to fabricate conductive graphene-based 3D micro-electronic circuits on any solid substrate including, Teflon, Delrin, silicon wafer, glass, metal or biodegradable/non-biodegradable polymer-based, 3D microstructured, flexible films. It was demonstrated that this novel method can be universally applied to many different natural or synthetic polymer-based films or any other solid substrates with proper pattern to create graphene-based conductive electronic circuits. This approach also enables fabrication of 3D circuits of flexible electronic films or solid substrates. It is a green process preventing the need for expensive and harsh postprocessing requirements for other fabrication methods such as ink-jet printing or photolithography. We reported that it is possible to fill the pattern channels with different dimensions as low as 10×10 μm. The graphene nanoplatelet solution with a concentration of 60 mg/mL in 70% ethanol, pre-annealed at 75° C. for 3 h, provided ˜0.5-2 kOhm resistance. The filling of the pattern channels with this solution at a flow rate of 100 μL/min created a continuous conductive graphene pattern on flexible polymeric films. The amount of graphene used to coat 1 cm2 of area is estimated as ˜10 μg. A second method regarding the transfer of graphene material-based circuits with small features size (5 μm depth, 10 μm width) from any solid surface to flexible polymeric films via polymer solvent casting approach was demonstrated. This method is applicable to any natural/synthetic polymer and their respective organic/inorganic solvents.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
IOWA STATE UNIVERSITY RESEARCH FOUNDATION INC1805 COLLABORATION PLACE SUITE 2100 AMES IA 50010

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mallapragada, Surya Ames, US 6 6
Uz, Metin Ames, US 4 4

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Sep 12, 2027
7.5 Year Payment $3600.00 $1800.00 $900.00 Sep 12, 2031
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 12, 2035
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00