Plasma processing apparatus and method

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11923179
APP PUB NO 20220310365A1
SERIAL NO

17368885

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Abstract

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A plasma processing apparatus for semiconductor processing includes an injector holder configured to removably mate with a structure defining an interior chamber of a plasma processing apparatus. The injector holder defines a first opening. A sleeve is configured to be received within the first opening, and the sleeve defines a second opening. A gas injector is configured to be received within the second opening of the sleeve.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDNO 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Pei-Yu Taoyuan, TW 10 12

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