Wafer processing method
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United States of America Patent
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Feb 27, 2024
Grant Date -
Feb 16, 2023
app pub date -
Jul 15, 2022
filing date -
Jul 15, 2022
priority date (Note) -
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Abstract
A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading the wafer part on the chuck table, spraying, by a spray arm module, a first processing solution onto the wafer part to process the wafer part, spraying, by the spray arm module, a second processing solution onto the wafer part to process the wafer part, drying the wafer part on the chuck table, and unloading the wafer part from the chuck table.
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