Micromechanical sensor unit and method for manufacturing a micromechanical sensor unit
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United States of America Patent
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Feb 27, 2024
Grant Date -
Nov 18, 2021
app pub date -
Dec 17, 2019
filing date -
Dec 21, 2018
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Abstract
A micromechanical sensor unit, including: a substrate and an edge layer, which is situated on the substrate and laterally frames an inner area above the substrate; at least one diaphragm, which spans the inner area and forms a covered cavity above the substrate; at least one support point, which is situated between the substrate and the diaphragm inside the cavity and attaches the diaphragm to the edge layer and/or to the at least one support point. The support point separates the diaphragm into at least one measuring area that is movable through force action and at least one reference area that is not movable through force action. The substrate and the diaphragm, inside the cavity, include electrodes, which face one another in the measuring area and the reference area.
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