Ground-connected supports with insulating spacers for semiconductor memory capacitors and method of fabricating the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 20, 2024
Grant Date -
May 27, 2021
app pub date -
Sep 25, 2020
filing date -
Nov 25, 2019
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device may comprise: a plurality of lower electrodes which are on a substrate; a first electrode support which is between adjacent lower electrodes and comprises a metallic material; a dielectric layer which is on the lower electrodes and the first electrode support to extend along profiles of the first electrode support and each of the lower electrodes; and an upper electrode which is on the dielectric layer.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully