Test head connection method
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United States of America Patent
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Feb 20, 2024
Grant Date -
N/A
app pub date -
Nov 6, 2021
filing date -
Nov 18, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.
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