Semiconductor wafer evaluation apparatus and semiconductor wafer manufacturing method
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United States of America Patent
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Feb 20, 2024
Grant Date -
May 12, 2022
app pub date -
Nov 5, 2021
filing date -
Nov 5, 2021
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Abstract
A semiconductor wafer evaluation apparatus brings a contact maker (mercury liquefied at room temperature), as a Schottky electrode, into contact with a semiconductor wafer, intermittently applies a voltage from a pulse power supply, and evaluates the state (kinds, density) of point defects by an evaluation means based on the status of the electrostatic capacity of the semiconductor wafer. In this manner, the state (kinds, density) of the point defects in the plane of a large-diameter semiconductor wafer is directly evaluated using a large table.
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