Gas quench for diffusion bonding

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United States of America Patent

PATENT NO 11905583
APP PUB NO 20220396857A1
SERIAL NO

17343482

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Abstract

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Exemplary methods of cooling a semiconductor component substrate may include heating the semiconductor component substrate to a temperature of greater than or about 500° C. in a chamber. The semiconductor component substrate may be or include aluminum. The methods may include delivering a gas into the chamber. The gas may be characterized by a temperature below or about 100° C. The methods may include cooling the semiconductor component substrate to a temperature below or about 200° C. in a first time period of less than or about 1 minute.

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Patent Owner(s)

  • APPLIED MATERIALS INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Agarwal, Sumit Dublin, US 107 3003
Behnke, Joseph F San Jose, US 4 4
Sommers, Joseph Frederick San Jose, US 11 1

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