Method for manufacturing wiring board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11903141
SERIAL NO

17400715

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Abstract

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A method for manufacturing a wiring board in which the adhesion between an underlayer and a seed layer is improved. A diffusion layer in which an element forming the underlayer and an element forming a coating layer are mutually diffused is formed between the underlayer and a wiring portion of the coating layer by irradiating the wiring portion with a laser beam. A seed layer is formed by removing a portion excluding the wiring portion of the coating layer from the underlayer. A metal layer is formed by disposing a solid electrolyte membrane between an anode and the seed layer and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from an insulating substrate.

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Patent Owner(s)

Patent OwnerAddress
TOYOTA JIDOSHA KABUSHIKI KAISHATOYOTA-SHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kato, Akira Toyota, JP 467 6914
Kondoh, Haruki Okazaki, JP 20 7
Kuroda, Keiji Toyota, JP 42 378
Mori, Rentaro Kasugai, JP 25 115
Okamoto, Kazuaki Toyota, JP 61 183
Yanagimoto, Hiroshi Miyoshi, JP 42 152

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