Flexible circuit board and chip package having a chip mounting region
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United States of America Patent
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Feb 13, 2024
Grant Date -
Feb 10, 2022
app pub date -
Jul 26, 2021
filing date -
Aug 4, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A flexible circuit board for a chip on film according to an embodiment includes: a substrate including a first surface and a second surface opposite to the first surface and including a chip mounting region; a circuit pattern layer disposed on the first surface; and a heat dissipation part disposed in the chip mounting region, wherein the substrate is formed with at least two or more holes that are formed in a region overlapping the heat dissipation part, and the heat dissipation part includes: a heat dissipation pattern layer disposed on the first surface; a connection layer disposed inside the hole; and a heat dissipation layer disposed on the second surface.
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