Wire bonding for semiconductor devices

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United States of America Patent

PATENT NO 11901327
SERIAL NO

17186715

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Abstract

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A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.

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Patent Owner(s)

Patent OwnerAddress
SANDISK TECHNOLOGIES INC951 SANDISK DRIVE LEGAL DEP MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Di, Xiaofeng Shanghai, CN 4 13
Lei, Yang Shanghai, CN 73 176
Lou, Yuyun Shanghai, CN 1 0
Qian, Zhonghua Shanghai, CN 6 0
Yan, Junrong Shanghai, CN 24 59

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