Iintegrated fan-out packages with embedded heat dissipation structure

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United States of America Patent

PATENT NO 11901258
APP PUB NO 20210233829A1
SERIAL NO

17227790

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Abstract

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A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSIN-CHU 300-77

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chia-Lun Tainan, TW 39 160
Chen, Cheng-Ting Taichung, TW 51 444
Chen, Wei-Yu Taipei, TW 709 6443
Cheng, Chia-Shen Hsinchu, TW 41 146
Hsieh, Ching-Hua Hsinchu, TW 265 2259
Lin, Chih-Wei Zhubei, TW 359 5145
Lin, Hsiu-Jen Zhubei, TW 172 1408
Liu, Chung-Shi Hsinchu, TW 824 11367
Pei, Hao-Jan Hsinchu, TW 46 104
Tsao, Chih-Chiang Taoyuan, TW 48 96

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