Modular pressurized workstation

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11901206
APP PUB NO 20230178401A1
SERIAL NO

18104731

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD.

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jeff New Taipei, TW 96 2162
Hsu, Kuang Huan Hsinchu, TW 12 5
Hsu, Yung-Lin Hsin-Chu, TW 23 73
Huang, Chun-Jung Yunlin County, TW 28 41
Huang, Steven Miaoli County, TW 34 614
Yang, Yueh-Lun Hsinchu County, TW 4 1

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