Resin composition for sealant, laminate, packaging material, and package

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United States of America Patent

PATENT NO 11898065
SERIAL NO

17293504

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Abstract

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A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane.

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Patent Owner(s)

Patent OwnerAddress
DOW-MITSUI POLYCHEMICALS CO LTDTOKYO 104-0028

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gonohe, Hisao Ichihara, JP 5 7
Hironaka, Yoshitaka Ichihara, JP 8 19
Machiya, Hiroaki Ichihara, JP 3 1
Nishijima, Koichi Ichihara, JP 20 144

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