Semiconductor device with capacitor contact surrounded by conductive ring and manufacturing method of the semiconductor device

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United States of America Patent

PATENT NO 11895823
SERIAL NO

17527117

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Abstract

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A semiconductor device and a manufacturing method are provided. The semiconductor device includes an active region, a bit line, a capacitor contact, a conductive ring and a storage capacitor. The active region is formed in a substrate. The bit line and the capacitor contact are disposed over the substrate and electrically connected with the active region. The bit line is laterally separated from the capacitor contact, and a top surface of the bit line is lower than a top surface of the capacitor contact. An upper portion of the capacitor contact is surrounded by the conductive ring. The storage capacitor is disposed over and in electrical contact with the capacitor contact and the conductive ring.

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Patent Owner(s)

Patent OwnerAddress
WINBOND ELECTRONICS CORPTAICHUNG CITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikeda, Noriaki Kanagawa, JP 54 318

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