Cooling arrangement

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United States of America

PATENT NO 11895810
SERIAL NO

17369514

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Abstract

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A power electronic assembly includes a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.

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Patent Owner(s)

Patent OwnerAddress
ABB SCHWEIZ AG5400 BADEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Manninen, Jorma Helsinki, FI 20 52
Pakarinen, Joni Helsinki, FI 8 26
Silvennoinen, Mika Helsinki, FI 24 104

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