Method of manufacturing electronic component module, and electronic component module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11876029
APP PUB NO 20210366801A1
SERIAL NO

17395574

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Abstract

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A method of manufacturing an electronic component module includes a sacrificial-body arrangement step of disposing a sacrificial body on a first principal surface of a support, the support including the first principal surface and a second principal surface, the sacrificial body being smaller than the first principal surface when viewed in a thickness direction of the support, a resin molding step of molding a resin structure on the first principal surface so as to cover the sacrificial body disposed on the first principal surface, a recess forming step of forming a recess in the resin structure by removing the sacrificial body, a wiring-layer forming step of forming a wiring layer on a side surface of the recess and on a principal surface of the resin structure, the principal surface connecting with the side surface, and a component mounting step of mounting an electronic component in the recess.

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Patent Owner(s)

Patent OwnerAddress
MURATA MANUFACTURING CO LTD10-1 HIGASHIKOTARI 1-CHOME NAGAOKAKYO-SHI KYOTO-FU 617-8555

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwamoto, Takashi Nagaokakyo, JP 181 2921

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