Tolerance ring and assembly
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United States of America Patent
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Jan 16, 2024
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app pub date -
Jul 15, 2019
filing date -
Jul 17, 2018
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Abstract
A tolerance ring including a substrate, and an overlying layer including at least one of a thermal enhancement layer and a retention layer, the thermal enhancement layer including at least one of i) Vickers hardness <400 VPM or ii) a thermal conductivity >100 W/m·K, the tolerance ring being adapted to provide at least one of a) a thermal transfer between the inner member and the outer member, b) a coefficient of friction between the retention layer and the outer member, μ1, and a coefficient of friction between the substrate and the outer member, μ2, and where μ1>μ2, or c) a retention force, Rf, between the inner member and the outer member, and the assembly has an assembly force, Af, and where Rf>0.1 Af, wherein the tolerance ring includes a plurality of projections protruding radially inward or radially outward.
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