Mems device having a rugged package and fabrication process thereof

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United States of America Patent

PATENT NO 11873215
SERIAL NO

17684317

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Abstract

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A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.

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Patent Owner(s)

Patent OwnerAddress
STMICROELECTRONICS S R LVIA C OLIVETTI 2 AGRATE BRIANZA (MB) 20864

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baldo, Lorenzo Bareggio, IT 80 703
Del, Sarto Marco Monza, IT 25 182
Duqi, Enri Milan, IT 56 120

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