Method for producing an aperture plate
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United States of America Patent
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Jan 16, 2024
Grant Date -
Feb 2, 2023
app pub date -
Aug 9, 2022
filing date -
May 23, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.
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