Semiconductor memory device including integrated control circuit and solid-state drive controller

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United States of America Patent

PATENT NO 11871576
SERIAL NO

17113285

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Abstract

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According to one embodiment, the array chip includes a three-dimensionally disposed plurality of memory cells and a memory-side interconnection layer connected to the memory cells. The circuit chip includes a substrate, a control circuit provided on the substrate, and a circuit-side interconnection layer provided on the control circuit and connected to the control circuit. The circuit chip is stuck to the array chip with the circuit-side interconnection layer facing to the memory-side interconnection layer. The bonding metal is provided between the memory-side interconnection layer and the circuit-side interconnection layer. The bonding metal is bonded to the memory-side interconnection layer and the circuit-side interconnection layer.

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Patent Owner(s)

Patent OwnerAddress
KIOXIA CORPORATIONTOKYO 108-0023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aochi, Hideaki Yokkaichi, JP 248 12462
Fukuzumi, Yoshiaki Yokkaichi, JP 352 11739
Kawasaki, Kazushige Kawasaki, JP 62 322
Matsuo, Mie Yokkaichi, JP 71 1932
Sanuki, Tomoya Yokkaichi, JP 71 293
Shindo, Koichiro Yokohama, JP 4 44
Yoshii, Kenichiro Bunkyo, JP 80 1211

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