Liquid ejecting apparatus and liquid ejecting head
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United States of America Patent
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Jan 9, 2024
Grant Date -
Sep 29, 2022
app pub date -
Feb 28, 2022
filing date -
Mar 1, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A liquid ejecting apparatus includes a liquid ejecting head including head chips each including a nozzle plate, a holder that is formed of resin, holds the head chips, and includes a flow path for supplying the liquid to each of the head chips, a holder cover that is formed of a material having a higher thermal conductivity than a thermal conductivity of the holder and houses the head chips and the holder, and a fixing plate that is formed of metal and to which the holder cover and the head chips are fixed, a carriage on which the liquid ejecting head is mounted, and a heater that is mounted on the carriage and heats the liquid inside each of the head chips via the holder cover and the fixing plate.
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