Wafer and method of manufacturing wafer

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United States of America Patent

PATENT NO 11862685
SERIAL NO

17665166

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Abstract

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The wafer having a retardation distribution measured with a light having a wavelength of 520 nm, wherein an average value of the retardation is 38 nm or less, wherein the wafer comprises a micropipe, and wherein a density of the micropipe is 1.5/cm2 or less, is disclosed.

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Patent Owner(s)

Patent OwnerAddress
SENIC INCCHUNGCHEONGNAM-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Jung Woo Cheonan-si, KR 66 197
Kim, Jung-Gyu Cheonan-si, KR 35 40
Ku, Kap-Ryeol Cheonan-si, KR 28 20
Kyun, Myung-Ok Cheonan-si, KR 20 21
Park, Jong Hwi Cheonan-si, KR 47 37

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