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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
EV GROUP E THALLNER GMBH	DI ERICH THALLNER STRASSE 1 ST FLORIAN AM INN A-4782

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Dragoi, Viorel	St. Florian am Inn, AT	11	34
Kurz, Florian	Pram, AT	21	69
Wimplinger, Markus	Ried im Innkreis, AT	79	805

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Jul 2, 2027
7.5 Year Payment	$3600.00	$1800.00	$900.00	Jul 2, 2031
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 2, 2035

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 02, 2024	US,11862487,B2   US11862487B2	GRANTED PATENT AS SECOND PUBLICATION
April 20, 2023	US,20230117625,A1   US20230117625A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 11862487

Device and method for bonding of two substrates

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