High-voltage feed-through capacitor
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United States of America Patent
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-
Jan 2, 2024
Grant Date -
Aug 17, 2023
app pub date -
Dec 15, 2022
filing date -
Feb 17, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
An element body is formed with a through hole to be open at a first main surface and a second main surface opposing each other. A through-conductor includes a first portion located inside the through hole and a second portion protruding from the second main surface. A case surrounds the element body and is electrically insulating. A cover surrounds the second portion and is electrically insulating. A first resin is contained in the case and coats the element body. A second resin is contained in the cover and is located in a space between an inner surface of the element body and the first portion. The second resin has an electrical resistivity less than an electrical resistivity of the first resin.
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