Process for manufacturing multi-layer substrates comprising sandwich layers and polyethylene

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United States of America Patent

PATENT NO 11858238
SERIAL NO

17665383

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Abstract

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Methods for forming multi-layer substrates including top and bottom surface layers and a melt softened thermoplastic material layer between the exterior surface layers, where the thermoplastic material includes polyethylene or has a tan delta value of 0.2 to 0.4 within the temperature range of 100° F.-350° F. The 3 (or more) layers are assembled, and heated, melt softening the thermoplastic material, causing bonding of the thermoplastic layer to the exterior surface layers. A cleaning composition may be loaded onto the multi-layer substrate, where a fluid pathway through the melted thermoplastic material allows the cleaning composition to travel between the surface layers. Adhesion between the surface layers and the thermoplastic layer is provided by the thermoplastic material itself, which bonds to groups of fibers in the surface layers. The process does not require chemical adhesives, any processing water, drying, or the like, so as to be possible with low capital investment.

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Patent Owner(s)

Patent OwnerAddress
THE CLOROX COMPANY1221 BROADWAY OAKLAND CA 94612

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Hubert Pleasanton, US 11 27
Dani, Nikhil P Pleasanton, US 51 530
Fritter, Daniela Pleasanton, US 13 112
Hendrix, Joerg Kennesaw, US 13 374
Pszczolkowski, Mark Pleasanton, US 5 12
Wood, Scott Pleasanton, US 24 232

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges9743701 - 1005010015020025030035040045050055060065070075080085090095010001050

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