Process for manufacturing multi-layer substrates comprising sandwich layers and polyethylene
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 2, 2024
Grant Date -
N/A
app pub date -
Feb 4, 2022
filing date -
Dec 21, 2018
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Methods for forming multi-layer substrates including top and bottom surface layers and a melt softened thermoplastic material layer between the exterior surface layers, where the thermoplastic material includes polyethylene or has a tan delta value of 0.2 to 0.4 within the temperature range of 100° F.-350° F. The 3 (or more) layers are assembled, and heated, melt softening the thermoplastic material, causing bonding of the thermoplastic layer to the exterior surface layers. A cleaning composition may be loaded onto the multi-layer substrate, where a fluid pathway through the melted thermoplastic material allows the cleaning composition to travel between the surface layers. Adhesion between the surface layers and the thermoplastic layer is provided by the thermoplastic material itself, which bonds to groups of fibers in the surface layers. The process does not require chemical adhesives, any processing water, drying, or the like, so as to be possible with low capital investment.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
THE CLOROX COMPANY | 1221 BROADWAY OAKLAND CA 94612 |
International Classification(s)
- A47L:DOMESTIC WASHING OR CLEANING
- B08B:CLEANING IN GENERAL; PREVENTION OF FOULING IN GENE....
- D21H:PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED....
- D21F:PAPER-MAKING MACHINES; METHODS OF PRODUCING PAPER ....
- C11D:DETERGENT COMPOSITIONS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chan, Hubert | Pleasanton, US | 11 | 27 |
# of filed Patents : 11 Total Citations : 27 | |||
Dani, Nikhil P | Pleasanton, US | 51 | 530 |
# of filed Patents : 51 Total Citations : 530 | |||
Fritter, Daniela | Pleasanton, US | 13 | 112 |
# of filed Patents : 13 Total Citations : 112 | |||
Hendrix, Joerg | Kennesaw, US | 13 | 374 |
# of filed Patents : 13 Total Citations : 374 | |||
Pszczolkowski, Mark | Pleasanton, US | 5 | 12 |
# of filed Patents : 5 Total Citations : 12 | |||
Wood, Scott | Pleasanton, US | 24 | 232 |
# of filed Patents : 24 Total Citations : 232 |
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Patent Citation Ranking
- 0 Citation Count
- A47L Class
- 0 % this patent is cited more than
- 1 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jul 2, 2027 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 2, 2031 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 2, 2035 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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Mar 02, 2023 | P | Published | |
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Aug 31, 2022 | F | Filing | |
Aug 31, 2022 | FEPP | FEE PAYMENT PROCEDURE | free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Aug 16, 2022 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FAN, CHEN-WEI;REEL/FRAME:060952/0299 Owner name: EGIS TECHNOLOGY INC., TAIWAN Effective Date: Aug 16, 2022 |
Aug 15, 2022 | PD | Priority Date |

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