Head-mounted temperature adjustment device
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United States of America Patent
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-
Jan 2, 2024
Grant Date -
N/A
app pub date -
Oct 4, 2023
filing date -
Aug 31, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a head-mounted temperature adjustment device, including a cap body, a temperature conduction sheet, and a temperature adjustment assembly. The temperature adjustment assembly includes a semiconductor temperature adjustment member and a fan, the temperature conduction sheet and the semiconductor temperature adjustment member are thermally conducted and both disposed in the cap body, the temperature conduction sheet is located on a side of the semiconductor temperature adjustment member facing a human head, and the fan is disposed on a side of the semiconductor temperature adjustment member facing away from the human head. In the above solution of the present disclosure, the head-mounted temperature adjustment device can be switched between a cooling mode and a heating mode to warm or cool the human head.
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