Electronic panel and method for manufacturing the same
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United States of America Patent
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Dec 26, 2023
Grant Date -
Jun 10, 2021
app pub date -
Feb 22, 2021
filing date -
Sep 4, 2018
priority date (Note) -
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Abstract
An electronic device includes an electronic panel including an active area and a pad area and including an input sensing member and a circuit board overlapping at least a side of the pad area. The electronic panel includes a first conductive layer, a second conductive layer, a first organic insulation layer disposed between the first conductive layer and the second conductive layer, a pattern layer disposed on the second conductive layer, overlapping the plurality of second conductive patterns, and including a plurality of organic patterns, and a second organic insulation layer covering the pattern layer and the second conductive layer. The pattern layer covers an upper surface of the second conductive layer.
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