Three-dimensional semiconductor memory device
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United States of America Patent
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Dec 26, 2023
Grant Date -
Feb 23, 2023
app pub date -
Nov 7, 2022
filing date -
Nov 28, 2018
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Abstract
A three-dimensional semiconductor memory device may include a first stack structure block including first stack structures arranged in a first direction on a substrate, a second stack structure block including second stack structures arranged in the first direction on the substrate, a separation structure disposed on the substrate between the first and second stack structure blocks and including first mold layers and second mold layers, and a contact plug penetrating the separation structure. A bottom surface of the contact plug may contact the substrate.
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