Integrate rinse module in hybrid bonding platform

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United States of America Patent

PATENT NO 11854795
APP PUB NO 20220216052A1
SERIAL NO

17655638

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Abstract

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A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chao, Lan-Lin Sindian, TW 87 2310
Chen, Xiaomeng Baoshan Township, TW 121 2120
Hsieh, Yuan-Chih Hsinchu, TW 102 1115
Huang, Xin-Hua Xihu Township, TW 73 1348
Kuang, Hsun-Chung Hsinchu, TW 107 498
Lin, Hung-Hua Taipei, TW 51 387
Liu, Ping-Yin Yonghe, TW 108 2161
Tsai, Chia-Shiung Hsinchu, TW 515 6971

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