Semiconductor wafer cleaning apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11854793
APP PUB NO 20210233766A1
SERIAL NO

17232218

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Abstract

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A semiconductor wafer cleaning apparatus is provided. The semiconductor wafer cleaning apparatus includes a spin base, a spindle, a clamping member, and a first sealing ring. The spin base has a through hole and a flange. The spindle extends through the through hole. The clamping member covers the through hole and is connected to the spindle. The clamping member includes a mounting part. The first sealing ring is disposed under the clamping member. A top surface of the first sealing ring and a top surface of the flange are in contact with a bottom surface of the mounting part.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSIN-CHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chia-Lun Taichung, TW 24 45
Hsu, Wen-Hung Taichung, TW 61 153
Hung, Ming-Sung Taichung, TW 10 4
Shih, Po-Jen Tainan, TW 87 297

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