Methods for measuring temperature of wafer chuck and calibrating temperature and system for measuring temperature

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United States of America Patent

PATENT NO 11852542
APP PUB NO 20210341342A1
SERIAL NO

17376584

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Abstract

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Methods for measuring a temperature of a wafer chuck and calibrating temperature and a temperature measuring system are provided. The measuring method includes: placing a test wafer on a wafer chuck, where a plurality of semiconductor devices having electrical parameters varying as a function of temperature are formed on the test wafer; making the temperature of the wafer chuck reach set temperatures; measuring the semiconductor devices respectively to obtain electrical parameters corresponding to the semiconductor devices; obtaining actual temperatures of the semiconductor devices according to the electrical parameters and variations, of the electrical parameters, as the function of temperature; and obtaining an actual temperature distribution of the wafer chuck according to the actual temperatures of the semiconductor devices.

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Patent Owner(s)

Patent OwnerAddress
CHANGXIN MEMORY TECHNOLOGIES INC230000 ROOM 630 HAI HENG MANSION 6 CUI WEI ROAD HEFEI ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE ANHUI HEFEI CITY ANHUI PROVINCE 230000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, ShihChieh Hefei, CN 4 2
Qian, Shibing Hefei, CN 4 3

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