Solder material

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United States of America Patent

PATENT NO 11850685
APP PUB NO 20190193210A1
SERIAL NO

16290401

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Abstract

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A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.

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Patent Owner(s)

Patent OwnerAddress
FUJI ELECTRIC CO LTDKAWASAKI COUNTY OF KANAGAWA CITY JAPAN KAWASAKI-SHI KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kodaira, Yoshihiro GuangDong, CN 23 113
Saito, Shunsuke Hachioji, JP 76 470
Watanabe, Hirohiko Hachioji, JP 25 172

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