Wave solder pallets for optimal solder flow and methods of manufacturing
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United States of America Patent
Stats
-
Dec 26, 2023
Grant Date -
Jun 11, 2020
app pub date -
Feb 11, 2020
filing date -
Nov 8, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.
First Claim
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Family
International Classification(s)
- 2020 Application Filing Year
- B29C Class
- 5432 Applications Filed
- 3212 Patents Issued To-Date
- 59.14 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B29C Class
- 0 % this patent is cited more than
- 2 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jun 26, 2027 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jun 26, 2031 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 26, 2035 |
