Curved semiconductor and method of forming the same

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United States of America Patent

PATENT NO 11848349
SERIAL NO

16389238

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Abstract

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A method of forming a curved semiconductor includes: forming a device layer on a semiconductor substrate; forming a metal layer on the device layer; removing the semiconductor substrate from the device layer; and curving the device layer and the metal layer.

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Patent Owner(s)

Patent OwnerAddress
HRL LABORATORIES LLC3011 MALIBU CANYON ROAD MALIBU CA 90265

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Freeman, Ryan Los Angeles, US 3 2
Gurga, Alexander R Canoga Park, US 3 2
Keefe, Andrew C Encino, US 58 788
McKnight, Geoffrey P Los Angeles, US 119 1379

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