Preparation device and process for anisotropic conductive film (ACF) bonding structure

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United States of America Patent

PATENT NO 11845251
APP PUB NO 20230256723A1
SERIAL NO

18020953

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Abstract

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A preparation device and a process for an anisotropic conductive film (ACF) bonding structure are provided. The preparation device includes a negative-pressure adsorption device, a positioning assembly, and a hot-pressing module, where the negative-pressure adsorption device is configured to adsorb a first metal plate; the positioning assembly includes a first positioning module, at least two second positioning modules, and at least one third positioning module; and the hot-pressing module is configured to release a hot-pressing pressure, such that the second metal plate is connected to the first metal plate through an ACF to form a bonding structure. The present disclosure ensures reference positioning of the negative-pressure adsorption device on a mounting plate through the second positioning modules. The present disclosure further ensures that a side of the first metal plate is fully adhered to a side surface of an adsorption plate through the first positioning module.

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Patent Owner(s)

Patent OwnerAddress
JIANGSU TELILAN COATING TECHNOLOGY CO LTDNO 3 HUDAI ROAD SOUTH ZONE HUDAI INDUSTRIAL PARK BINHU DISTRICT JIANGSU PROVINCE WUXI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Xu, Zheng Wuxi, CN 334 5242
Xu, Zhengliang Wuxi, CN 2 0
Zheng, Liang Wuxi, CN 27 57

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