Methods for manufacturing ultrasound transducers and other components
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United States of America Patent
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Dec 19, 2023
Grant Date -
Jul 16, 2020
app pub date -
Mar 23, 2020
filing date -
Sep 18, 2008
priority date (Note) -
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Abstract
The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.
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