Wafer inspection method and inspection apparatus

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United States of America Patent

PATENT NO 11841381
APP PUB NO 20230105061A1
SERIAL NO

17950467

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Abstract

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A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.

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Patent Owner(s)

Patent OwnerAddress
CHROMA ATE INCNO 88 WENMAO RD GUISHAN DIST TAOYUAN CITY 333001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Min-Hung Taoyuan, TW 6 26
Chao, Tzu-Tu Taoyuan, TW 3 0
Tseng, I-Shih Taoyuan, TW 18 62
Wang, Tsun-I Taoyuan, TW 37 313

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