Semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11837516
APP PUB NO 20210305111A1
SERIAL NO

17256841

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In a semiconductor device, on a heat dissipation portion of a lead frame opposite to a mounting portion on which a semiconductor element is mounted, a thin molding portion having a thickness of about 0.02 mm to 0.3 mm is formed by a second molding resin which is a high-heat-dissipation resin. A scale-like portion on which scale-shaped projections are consecutively formed is provided over both sides across a resin boundary portion of the heat dissipation portion. The scale-like portion reaches abutting surfaces of an upper die and a lower die of a mold used in a molding process. Thus, the same void inhibition effect as with an air vent is obtained.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATION7-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 1008310 ?1008310

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujita, Atsuki Tokyo, JP 5 8
Hamada, Masakazu Tokyo, JP 9 114
Kajihara, Takanobu Tokyo, JP 8 42
Nagao, Takashi Tokyo, JP 145 1186
Omae, Katsuhiko Tokyo, JP 20 166
Takeshita, Ryosuke Tokyo, JP 2 0

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