Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device

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United States of America Patent

PATENT NO 11835849
APP PUB NO 20230194983A1
SERIAL NO

18109399

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Abstract

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Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A),

    in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group,a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A),a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A),a glass transition temperature of the resin (A) is 145° C. or lower, andthe actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 μm or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATIONTOKYO 106-8620

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hatakeyama, Naoya Shizuoka, JP 36 977
Higashi, Kohei Shizuoka, JP 30 4598
Nishida, Yoichi Shizuoka, JP 54 388
Yonekuta, Yasunori Shizuoka, JP 47 73
Yoshimura, Tsutomu Shizuoka, JP 41 583

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